[Oral Presentation]基于热-力比拟颗粒接触导热的新型热离散元模型

Organized By

Hohai University

Monash University

Co-organized by

Southeast University

Jiangxi University of Science and Technology

Northeast University

DUT-BSU Scientific Research and Innovation Center

Suzhou University of Science and Technology

State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment

Sponsoring agency

KELI SDEM Software (Dalian) Co., Ltd.

Sugon Smart Computing Information Technology Co., Ltd.

Beijing Paratera Technology Co., Ltd.

Simpop Information Technology Co., Ltd.

Important Dates

Conference Announcement

December 2023, release First Round Announcement
Abstract Submission Deadline
March 31^th, 2024
Paper Submission Deadline
April 30^th, 2024
Registration
From January 1^st, 2024
Conference Schedule
May 31^st (Friday), 2024 On-Site Registration
June 1^st to 3^rd, 2024 Conference

基于热-力比拟颗粒接触导热的新型热离散元模型

ID：226 Submission ID：312 View Protection：PUBLIC Updated Time：2024-07-24 13:29:40 Hits：749 Oral Presentation

Start Time：Pending （Asia/Shanghai）

Duration：Pending

Session：[No Session] » [No Session Block]

Attachment File

Abstract

本文基于热力比拟的思路提出了一种新型颗粒间接触导热热阻模型，通过假设热通量在接触表面上的分布类似于应力的分布，消除了传统热阻模型在接触边缘处温度奇异性的问题。该模型在基本堆积方式和实际堆积方式下与现有的理论公式和实验进行比较，验证了使用该热阻模型预测颗粒材料导热系数的可行性。将该热阻模型运用到热离散单元法中，分析了高温试验装置内卵石床的温度和有效导热系数分布。由热传导方式得到的平均有效导热系数在20 kW和82 kW功率输入时分别为2.99和2.61 W/m·K。对于该空心圆柱构成的球床，当外壁温度从200 °C增加到1000 °C时，有效热扩散系数大约增加了20%。

Keywords

热力比拟,接触热阻模型,热离散单元法,有效导热系数,有效热扩散率

Speaker

罗一洋

清华大学

Submission Author

罗一洋清华大学

桂南清华大学

杨星团清华大学

屠基元清华大学；皇家墨尔本理工大学

姜胜耀清华大学

Sponsored By

Hohai University

Panel of Computational Mechanics on Granular Materials, Working Party of Computational Mechanics, Chinese Society of Theoretical and Applied Mechanics

Jiangsu Society of Theoretical and Applied Mechanics