河海大学
蒙纳士大学
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| Nowadays, thermal management permeates all fields, including industry, building environment, fabric, etc., and it has become a bottleneck restricting all fields. Thermal management in building environment faces great challenges. About 50% of the electricity used in residential and commercial buildings is used for indoor heating and air-conditioning systems, resulting in significant energy consumption. About 50% of the heat exchange comes from glass, 30% from walls, and 10% from the roof. Several energy-efficient building thermal management solutions have been tried, essentially to keep thermal radiation out of the building and thereby reduce the energy consumption of indoor cooling systems. Such approaches would have many savings in the tropics but would face higher indoor heating costs in densely populated temperate and frigid zones. How to use smart materials for building thermal management has become a new trend. Thermal management in electronics is also one of the two major IC challenges in parallel with chip manufacturing. In the past 15 years, the main frequency of chips has not improved significantly, and the chip performance mainly depends on the integration and miniaturization of transistors. The heat flux of the chip surface is much higher than that of the sun, and the development of the chip manufacturing process is also sluggish. The development of stacked semiconductor technology will pose a great challenge to thermal management in the future. In recent years, with the development of 5G technology, thermal management materials also need to take into account their excellent electromagnetic properties, to control the influence of electromagnetic waves on devices. It is an urgent and important task to develop thermal management materials with excellent properties. |
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