[Oral Presentation]颗粒材料高性能计算平台SudoSim研发进展

Organized By

Hohai University

Monash University

Co-organized by

Southeast University

Jiangxi University of Science and Technology

Northeast University

DUT-BSU Scientific Research and Innovation Center

Suzhou University of Science and Technology

State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment

Sponsoring agency

KELI SDEM Software (Dalian) Co., Ltd.

Sugon Smart Computing Information Technology Co., Ltd.

Beijing Paratera Technology Co., Ltd.

Simpop Information Technology Co., Ltd.

Important Dates

Conference Announcement

December 2023, release First Round Announcement
Abstract Submission Deadline
March 31^th, 2024
Paper Submission Deadline
April 30^th, 2024
Registration
From January 1^st, 2024
Conference Schedule
May 31^st (Friday), 2024 On-Site Registration
June 1^st to 3^rd, 2024 Conference

颗粒材料高性能计算平台SudoSim研发进展

ID：268 Submission ID：185 View Protection：ATTENDEE Updated Time：2024-04-30 10:45:24 Hits：833 Oral Presentation

Start Time：Pending （Asia/Shanghai）

Duration：Pending

Session：[No Session] » [No Session Block]

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Abstract

为进一步响应国家“十四五”规划对工业软件研发的迫切需要，SudoSim研发团队依托香港科技大学计算颗粒力学实验室，持续不断地推进颗粒材料高性能计算平台SudoSim的研发工作。颗粒材料的物理力学特性错综复杂，对准确、高效数值模拟带来极大挑战。SudoSim平台涵盖基于连续介质力学方法（如物质点法）、离散介质力学方法（如离散单元法）及连续-离散多尺度耦合方法（如离散元-物质点法耦合）等三大模拟方法。基于Python、C++/CUDA C++，通过模块化编程技术，SudoSim可将不同数值方法模块进行高效耦合。此外，在大规模计算方面，SudoSim采用了基于光线追踪硬件加速数值计算原创技术，同时将光线追踪渲染无缝结合。以光线追踪离散元法为例，计算效率可达到国外著名商业软件的1000倍提速。

Keywords

颗粒材料，计算力学，工业软件，GPU计算，离散元法，物质点法

Speaker

赵仕威

香港科技大学

Submission Author

赵仕威香港科技大学

陈昊香港科技大学

赵吉东香港科技大学

Sponsored By

Hohai University

Panel of Computational Mechanics on Granular Materials, Working Party of Computational Mechanics, Chinese Society of Theoretical and Applied Mechanics

Jiangsu Society of Theoretical and Applied Mechanics