Granular Computing Committee of Chinese Society of Granular Engineering (Preparatory)
Hohai University
Monash University
Start Time：Pending （Asia/Shanghai）
Duration：Pending
Session：[No Session] » [No Session Block]
No files
| With the rapid advancement of artificial intelligence and 5G technology, the demand for computing and communication devices is exploding. This has led to a significant increase in the load of these devices, making thermal management a critical challenge for the stability of device performance. Especially in highly integrated devices, achieving efficient heat dissipation in a limited space while controlling electromagnetic interference has become a pressing issue. Traditional cooling solutions and materials face challenges in terms of effectiveness, making the development of new thermal management technologies and materials critical. One solution is anisotropic heat transfer, or the control of heat transfer paths. Thermal conductive fibers, as highly customizable one-dimensional heat transfer media, can be designed into various macroscopic shapes to meet different cooling requirements. However, when faced with more complex application scenarios, such as the need for thermal conductivity combined with electrical insulation or low dielectric constants, traditional single-component conductive fibers often fall short. In this context, composite fibers made of two-dimensional materials demonstrate their advantages not only in achieving efficient anisotropic thermal conductivity, but also in incorporating additional functionalities by combining different materials. By precisely controlling the arrangement of 2D materials within the fibers, it's possible to further tune the comprehensive properties of the materials, achieving the coupling of thermal, electrical, optical, magnetic and mechanical performance. In addition, innovations based on existing materials, such as the design of fiber microstructures and the exploration of multiphysical field heat and mass transfer behaviors within the fibers, are critical to the development of the next generation of thermal management materials. |
Comment submit