[Oral Presentation]Two-dimensional material film for thermal management of electronic devices

Two-dimensional material film for thermal management of electronic devices
ID:233 Submission ID:302 View Protection:ATTENDEE Updated Time:2024-04-30 10:34:09 Hits:439 Oral Presentation

Start Time:Pending (Asia/Shanghai)

Duration:Pending

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Abstract
The rapid proliferation of electronic devices has led to a consequential surge in the demand for thermal management products. However, this growth has paralleled a concerning increase in electronic waste (e-waste) generated by these products, posing significant environmental and resource depletion challenges. The conventional thermal management materials, predominantly comprising high-purity metals and mineral materials, pose recycling challenges due to their integration within electronic components.
This research project addresses these challenges by proposing the utilization of two-dimensional materials for interface heat transfer in composite films. Specifically, boron nitride (BN) is explored as a promising two-dimensional material in combination with various solid wastes to develop biodegradable composite films with superior thermal and mechanical properties. One such endeavor involves the preparation of a biodegradable, highly thermally conductive composite film utilizing mango waste, a substantial byproduct of mango processing industries.
Mango waste, comprising peels and kernels, accounts for a significant portion of the fruit's total volume and presents environmental and economic concerns due to its high generation rate and insufficient treatment. By integrating mango waste into composite films alongside two-dimensional materials, we aim to not only repurpose solid waste but also mitigate environmental issues associated with both solid waste and e-waste.
This research endeavors to contribute to the development of sustainable solutions for thermal management in electronic devices while addressing pressing environmental challenges posed by waste accumulation.
 
Keywords
Thermal Management
Speaker
ZhongYueni
Monash University

Submission Author
ZhongYueni Monash University
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